Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging.

Description: The solicitation seeks proposals to demonstrate high-speed, ultra-low-power optical-channel operation in cryogenic environments using co-packaged digital readout integrated circuits and photonics for advanced infrared imaging. It targets integration of electronics and photonics on a single silicon wafer or through foundry-level integration before detector hybridization, with the readout integrated circuit supporting high-throughput data generation and configurable electrical and optical outputs. The official topic posting identifies this as DoD SBIR topic OSW26BZ05-NV021 under solicitation 26.BZ, with proposals opening on August 26, 2026 and due on September 23, 2026.