Open RFP

Additive Manufacturing for Flexible Electronics

Description: The Defense Microelectronics Activity (DMEA) Year 2026 topic DME26BZ05-NV001 is a specific SBIR Phase I solicitation titled "Additive Manufacturing for Flexible Electronics." It concerns additive manufacturing (3D printing) for electronics packaging and flexible electronics, including RF electronics on flexible substrates and additive substrate or advanced-packaging methods. The official opportunity shows an open date of August 26, 2026 and a close date of September 23, 2026, so it is open on 2026-08-07.

Released
Aug 26, 2026
Closes
Sep 23, 2026(46 days left)

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