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The Montana Microfabrication Facility (Montana State University) issued an Invitation for Bid to procure a single chip bonding tool to support assembly and packaging of photonic integrated circuits and related devices. The procurement covers the purchase of one chip bonding tool meeting specified alignment, bonding force, and programmable temperature ramp requirements, with total cost to include shipping, tariffs, training, and applicable university discounts. Bidders must submit sealed bids and provide required administrative documents (W-9, remit-to address, contact info) and register in SmartBuyMSU if awarded.
Starbridge can help you:
Pain points mentioned in board meetings and strategic plans
Instantly outline and draft all requirements
Bring in your USPs and exploit competitor gaps
Starbridge can help you:
Get ahead of RFPs — target accounts planning budget or ending contracts soon
Accounts with contract expirations, meetings mentioning your product, grants, budget changes and more
Starbridge.ai books 30 - 40% of leads into meetings
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The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.
Posted Date
Jan 5, 2026
Due Date
Jan 16, 2026
Release: Jan 5, 2026
Close: Jan 16, 2026
The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.
AvailableFor the work of a hot chip seal.
Posted Date
Dec 16, 2025
Due Date
Jan 13, 2026
Release: Dec 16, 2025
Close: Jan 13, 2026
For the work of a hot chip seal.
AvailableChip design and manufacturing.
Posted Date
Nov 10, 2025
Due Date
Jan 9, 2026
Release: Nov 10, 2025
Close: Jan 9, 2026
Chip design and manufacturing.
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