Closing soon

Die Bonding and Vacuum Packaging System

Description: The Naval Research Laboratory is soliciting one lot for a die bonding and vacuum packaging system to support experimental chip mounting and package sealing. The equipment must meet the technical specifications in Attachment 1, and bidders must provide a technical description demonstrating compliance along with the required representations and certifications. This is a full-and-open fixed-price procurement for delivery to the Naval Research Laboratory in Washington, DC, with delivery expected six months after award; it is not a grant program.

Buyer: Naval Research Laboratory (NRL)
Federal · DC, US
Released: Jul 23, 2026
Closes: Aug 7, 2026(9 days left)

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