Open RFP

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies (Request for Information)

Description: Secure packaged microelectronic components, printed circuit boards, and supporting technologies.

Buyer: Army Contracting Command (ACC)
Federal · AL, US
Released: Aug 17, 2026
Closes: Sep 16, 2026(28 days left)

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Key Contacts

Procurement and program contacts connected to Army Contracting Command (ACC).

Jennifer S. KimzeyActing Director, Mission Operations Directorate (ACC-Redstone Arsenal)

*******@************

+1 (***) ***-****

Gino MagnificoChief Information Officer (CIO/G6)

*******@************

+1 (***) ***-****

Ed StaytonCIO/G6 Chief Technology Officer

*******@************

+1 (***) ***-****

Douglas S. LowreyCommanding General

*******@************

+1 (***) ***-****

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