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Discover Opportunities months before the RFP drops
Learn more →Discover Opportunities months before the RFP drops
Learn more →Retrieving RFP details
Pain points mentioned in board meetings and strategic plans
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Accounts with contract expirations, meetings mentioning your product, grants, budget changes and more
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Verified names, emails & phone numbers
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Line-item pricing breakdowns
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Paul M. Hebert Law Center
Custom-Fabricated Double-Sided Silicon Strip Sensors.
Pain points mentioned in board meetings and strategic plans
Instantly outline and draft all requirements
Bring in your USPs and exploit competitor gaps
Get ahead of RFPs — target accounts planning budget or ending contracts soon
Accounts with contract expirations, meetings mentioning your product, grants, budget changes and more
Starbridge.ai books 30 - 40% of leads into meetings
Louisiana State University
LSU solicits bids for 10 custom-fabricated double-sided silicon-strip sensors for charged-particle detection. Key requirements: high-purity ion-implanted planar silicon, thickness 0.050 mm (±10%), chip size ~70.0×36.0 mm (±0.1 mm), front segmentation 32 strips (2×32 mm per strip), rear segmentation 4 strips (64×8 mm per strip), interstrip ≤0.1 mm, deadlayer ≤500 nm per face, packaged with custom PCB, readout: two IDC headers (2.5 mm pitch, 2×10 pins). Bid price must include all non-recurring engineering (mask and PCB design); LSU must approve design drawings; leakage current <2 µA at full-depletion bias at delivery.
Posted Date
Nov 21, 2025
Due Date
Dec 11, 2025
Release: Nov 21, 2025
Louisiana State University
Close: Dec 11, 2025
Verified names, emails & phone numbers
AI-predicted best buyers in the org
Auto-sync to Salesforce & HubSpot
Access the largest public sector contact database
See which competitors are likely to bid
Line-item pricing breakdowns
Contract expiration map of your TAM
Get complete source documentation & analysis
LSU solicits bids for 10 custom-fabricated double-sided silicon-strip sensors for charged-particle detection. Key requirements: high-purity ion-implanted planar silicon, thickness 0.050 mm (±10%), chip size ~70.0×36.0 mm (±0.1 mm), front segmentation 32 strips (2×32 mm per strip), rear segmentation 4 strips (64×8 mm per strip), interstrip ≤0.1 mm, deadlayer ≤500 nm per face, packaged with custom PCB, readout: two IDC headers (2.5 mm pitch, 2×10 pins). Bid price must include all non-recurring engineering (mask and PCB design); LSU must approve design drawings; leakage current <2 µA at full-depletion bias at delivery.
National Institute of Standards and Technology
Custom magneto-resistive sensors.
Posted Date
Dec 8, 2025
Due Date
Dec 22, 2025
Release: Dec 8, 2025
National Institute of Standards and Technology
Close: Dec 22, 2025
Custom magneto-resistive sensors.
AvailableTexas Department of State Health Services
Provide custom wheelchair, acessories, parts.
Posted Date
Sep 25, 2025
Due Date
Jan 5, 2026
Release: Sep 25, 2025
Texas Department of State Health Services
Close: Jan 5, 2026
Provide custom wheelchair, acessories, parts.
AvailableNational Institute of Standards and Technology
The National Institute of Standards and Technology (NIST) issued a Sources Sought (NIST-SS26-CHIPS-35) requesting market responses for fabrication of custom magneto-resistive, bare-die sensors to be used in a scanning magnetic microscope for CHIPS Metrology Project 03.12 (3D Thermal Imaging of Advanced Packages). Minimum technical requirements include operation from DC to 100 kHz, specified field sensitivities (1 nT/Hz^0.5 at 1 kHz and 10 nT/Hz^0.5 at 100 Hz), sensor dimensions of 2 mm x 2 mm, and delivery of at least one wafer (minimum 100 sensors) with documentation and one year technical support. This is a Sources Sought (market research) notice (not a grant or a solicitation for award), posted on Dec 8, 2025 and currently open with responses due Dec 22, 2025 at 5:00 p.m. EST.
Posted Date
Dec 8, 2025
Due Date
Dec 22, 2025
Release: Dec 8, 2025
National Institute of Standards and Technology
Close: Dec 22, 2025
The National Institute of Standards and Technology (NIST) issued a Sources Sought (NIST-SS26-CHIPS-35) requesting market responses for fabrication of custom magneto-resistive, bare-die sensors to be used in a scanning magnetic microscope for CHIPS Metrology Project 03.12 (3D Thermal Imaging of Advanced Packages). Minimum technical requirements include operation from DC to 100 kHz, specified field sensitivities (1 nT/Hz^0.5 at 1 kHz and 10 nT/Hz^0.5 at 100 Hz), sensor dimensions of 2 mm x 2 mm, and delivery of at least one wafer (minimum 100 sensors) with documentation and one year technical support. This is a Sources Sought (market research) notice (not a grant or a solicitation for award), posted on Dec 8, 2025 and currently open with responses due Dec 22, 2025 at 5:00 p.m. EST.
AvailableSurface intent from meeting minutes, budgets, and contract expirations. Influence RFP requirements before competitors ever see them.
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