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Learn more →Key metrics and characteristics
The city where this buyer is located.
The county where this buyer is located.
Postal code for this buyer's location.
How likely this buyer is to spend on new technology based on operating budget trends.
How likely this buyer is to adopt new AI technologies.
How often this buyer champions startups and early adoption.
Includes fiscal year calendars, procurement complexity scores, and strategic insights.
Active opportunities open for bidding
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Seeking for materials dispensing system.
Posted Date
May 19, 2026
Due Date
May 22, 2026
Release: May 19, 2026
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Close: May 22, 2026
Seeking for materials dispensing system.
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Seeking for 4 each 20' new containers.
Posted Date
May 18, 2026
Due Date
May 21, 2026
Release: May 18, 2026
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Close: May 21, 2026
Seeking for 4 each 20' new containers.
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Provide engineering, analysis, design, and support for various Inertial Sensor Programs to NTESS, including but not limited to: Microelectromechanical systems (MEMS), Application Specific Integrated Circuits (ASICs), Fabrication techniques, Production facilities optimization, System level test plans with the next level of assembly (NLA), Concept of Operations (CONOP), Prototyping fabrication and testing, Electrical performance characterization over a suite of mechanical, radiation, thermal and combined environments, Microelectronics packaging, Integration of microelectronics packaging, Reliability and life assessment.
Posted Date
May 14, 2026
Due Date
May 22, 2026
Release: May 14, 2026
National Technology & Engineering Solutions of Sandia (NTESS) (Contractor)
Close: May 22, 2026
Provide engineering, analysis, design, and support for various Inertial Sensor Programs to NTESS, including but not limited to: Microelectromechanical systems (MEMS), Application Specific Integrated Circuits (ASICs), Fabrication techniques, Production facilities optimization, System level test plans with the next level of assembly (NLA), Concept of Operations (CONOP), Prototyping fabrication and testing, Electrical performance characterization over a suite of mechanical, radiation, thermal and combined environments, Microelectronics packaging, Integration of microelectronics packaging, Reliability and life assessment.
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