Summary
The Missile Defense Agency (MDA) requests proposals to develop processes that radiation-harden commercial microelectronics not originally designed for radiation or space environments, using techniques such as advanced packaging, chiplets, or heterogeneous integration. The objective is to enable high-performance commercial components (e.g., sub-16nm FinFETs or GAA) to achieve a minimum Single Event Latch-up (SEL) immunity of 75 LET and Total Ionizing Dose (TID) survival of 300 kRad(Si), potentially via watchdog chiplets or package-on-package approaches. The solicitation is listed as an open DoD SBIR topic with an open date of July 22, 2026 and a due/close date of August 19, 2026.