Summary
The Defense Microelectronics Activity (DMEA) issued Solicitation HQ072726QCB04 for the manufacture of sheet-metal enclosures for Data Transfer Devices (DTD) after the original manufacturer (Hirose) discontinued the parts and no supplier remains. The contract requires design and fabrication of production-level sheet metal stamping dies (first articles) and delivery of production units for Side A and Side B (including CLINs for dies, first articles, production units and shipping), and the contractor must retain the stamping dies for at least one year. The opportunity is set aside for Service-Disabled Veteran-Owned Small Businesses (SDVOSBC), lists McClellan, CA as the place of performance, was posted July 16, 2026, and has a response deadline of July 31, 2026 at 5:00 p.m. EDT.