Summary
Engineering, System Engineering and Safety and Process Engineering: The Contractor shall apply the engineering disciplines to support the design, development, test, evaluation, and engineering related logistics for Depot tasking associated with Airborne EW systems, subsystems, equipment, and components, and associated platforms, as applicable. This engineering support may require the Contractor to perform reverse engineering on electronic and mechanical assemblies and deliver to the Government a design disclosure Technical Data Package (TDP). (CDRL A001). The subject engineering support may also include material development, material/process demonstrations and process engineering support for electronic engineering interconnection fabrication, electronic assembly fabrication process, and lead-free solder research and analysis. As such, the Contractor must have in-depth knowledge of specialized material and processes for EW applications (i.e., radomes, antennas, and power supplies). The Contractor may also provide engineering support to develop techniques, instructions, and guidance on a variety of electronic component types including, but not limited to, through-hole components; dual-inline-package; flat pack; and high-density, high-complexity surface mount technology circuit card assemblies (CCA) or modules. This may include development and improvement of surface mount technology removal and replacement processes. (CDRL A002). See attached file.